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%ما هو (من)٪ 1 - تعريف
DISCRETE ELECTRONIC ASSEMBLY CONTAINING MULTIPLE INTEGRATED CIRCUITS THAT BEHAVES AS A UNIT
Multichip module; Multi-chip package; Multi-Chip Module; Multi-Chip module; Multi chip module; Heterogeneous integration; Chip stack multi-chip module
![Wireless NoC on [[3D integrated circuit]]](https://commons.wikimedia.org/wiki/Special:FilePath/Wireless TSV (model).PNG?width=200 "Wireless NoC on [[3D integrated circuit]]")
Module (mathematics)
GENERALIZATION OF VECTOR SPACE, WITH SCALARS IN A RING INSTEAD OF A FIELD
Module (algebra); Submodule; Module theory; Submodules; R-module; Module over a ring; Left module; Module Theory; Unital module; Module (ring theory); Right module; Left-module; Module mathematics; Ring action; Z-module; ℤ-module
In mathematics, a module is a generalization of the notion of vector space in which the field of scalars is replaced by a ring. The concept of module generalizes also the notion of abelian group, since the abelian groups are exactly the modules over the ring of integers.
Dualizing module
Canonical module; Dualising module
In abstract algebra, a dualizing module, also called a canonical module, is a module over a commutative ring that is analogous to the canonical bundle of a smooth variety. It is used in Grothendieck local duality.
Differential graded module
Z-GRADED MODULE WITH A COMPATIBLE DIFFERENTIAL
Draft:Differential graded module; Dg-module; Dg module; DG-module; DG module
In algebra, a differential graded module, or dg-module, is a \mathbb{Z}-graded module together with a differential; i.e.
ويكيبيديا
Multi-chip module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
